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Fully Hong's plan for international Component fairs in 2nd Half of 2019

2019/08/26

Fully Hong will attend the following component trade fairs, and warmly welcome to booths for more negotiation.

1) Sep. 11-13, Nepcon Vietnam 2019,I.C.E. Hanoi (Cung Van Hoa), Booth No. : F26

2) Oct. 16-18, International Exhibition for Electronics, Microelectronics & Components, Expo Centre, Moscow, Russia, Booth No.: E14

 3) Dec. 17-19, International Consumer Electronics Expo Indonesia, Jakarta Convention Center, Booth No. G12

 


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