This 4-layer FR4 PCB is specifically designed for gas analyzer applications, where precision signal conditioning, thermal stability, and EMI resistance are critical for accurate gas concentration measurement. With dimensions of 108.00mm×115.00mm and a 1.5mm Dicke, the board provides a balanced foundation for integrating sensor interfaces, signal amplifiers, and data processing circuitry in compact gas analyzer enclosures. Gebaut von FR4 material, it offers reliable electrical insulation (Dielektrizitätskonstante εr = 4,5) and mechanical durability, suitable for operation in industrial environments with varying temperatures and humidity.

 

Der 1.5Oz (52μm) Kupferdicke on all layers ensures efficient power distribution and signal routing, supporting moderate current loads (up to 12A per trace) while minimizing voltage drop. Der 4-Schichtarchitektur (2 Signalschichten + 2 ground/power planes) separates analog and digital domains, reducing cross-talk and EMI—essential for maintaining the sensitivity of gas sensor signals (often in the microvolt range). Der Grüne LPI Lötmaske protects circuitry from environmental contaminants, während die Weißer Siebdruck provides clear component marking for assembly and maintenance in complex gas analyzer layouts. Der Bluten (Hot Air Solder Leveling) surface finish creates a uniform, solder-friendly coating (lead-free SAC305 alloy), ensuring reliable connections for fine-pitch components (down to 0.4mm pitch) and through-hole sensors.

Gas Analyzer-Specific Design Features

  • EMI-Shielded Signal Paths:
    • Ground planes isolate analog sensor signals from digital noise, critical for ppm-level gas detection accuracy.
    • Differential routing for Wheatstone bridge sensor interfaces to minimize common-mode interference.
  • Thermal Management:
    • Thermal vias connect power components to ground planes for efficient heat dissipation, maintaining sensor stability in temperature-sensitive gas analysis.
  • Sensor Interface Optimization:
    • Low-noise power supplies (±1% ripple) for electrochemical and infrared gas sensors.
    • Protection circuitry (TVS diodes, fuses) against transient spikes from sensor excitation voltages.

Manufacturing & Qualitätskontrolle

  • 2×2 Panel Format:
    • Each panel contains 4 identical boards, reducing production costs and enabling efficient mass assembly for gas analyzer OEMs.
  • Precision Fabrication:
    • Laser direct imaging (LDI) for 75μm line/space accuracy in sensor signal traces.
    • Electrolytic copper plating with ±5% thickness uniformity across all layers.
  • Testing Protocols:
    • 100% AOI inspection for solder mask coverage and silkscreen clarity.
    • Flying probe testing for electrical continuity and isolation (≥100MΩ).
    • Thermal cycling (-40°C to +85°C, 100 cycles) to verify reliability in harsh industrial environments.
  • Compliance:
    • Meets IPC-6012 Class 2 standards for industrial electronics.
    • RoHS compliant for lead-free manufacturing.

Applications in Gas Analysis Systems

  • Industrial Safety Monitors:
    Controls for combustible gas detectors (e.g., methane, propane) in oil refineries, chemical plants, and mining sites.
  • Environmental Monitoring:
    Processes data from air quality sensors (CO, NO2, O3) in smart cities or research laboratories.
  • Medical Diagnostics:
    Supports breath analysis equipment for non-invasive disease detection in healthcare settings.
  • Process Control:
    Optimizes gas mixtures in semiconductor manufacturing, food packaging, or pharmaceutical production.

 

By integrating 4-layer EMI shielding, 1.5OZ copper conductivity, and gas analyzer-specific design features, this PCB enables engineers to build reliable, accurate gas detection systems. The 2×2 panel format balances production efficiency with design flexibility, while HASL finish ensures cost-effective soldering for high-volume manufacturing. Unterstützt von ISO 9001:2015 certification, this PCB delivers consistent performance for gas analyzers where measurement precision and system reliability are non-negotiable.

PCB -Fähigkeit


Artikel Standard -PCB Customized PCB
Anzahl der Schichten 2-20 2-50
Material FR4 Hallo Geschwindigkeitsmaterial von Taiwan Union, Und Technik, Hochfrequenzmaterial von Rogers usw..
Dicke der Leiterplatte 0.4-3.2mm 0.4-6.4mm
Kupfergewicht Bring-3o Bring-10
Min. Lochdurchmesser 0.3mm 0.1MM durch Laserbohrer
PCB -Größe Min. 6.00X6.00 mm max. 600.00X620.00 mm
PCB -Finish Hal, Hal-Leadfree, Zustimmen, Enepic, Eintauchen, Eintauchen Silber, OSP
Min.Soldmask Dam. 4mils für 1oz 2.5mils für 1oz
Prepreg -Typ 2116,1080 2116,1080,7628,3313,106
Min.Width/Space 4/4 Mils 2.5/2.5 Mils
Min. Ringring 4/4 Mils 2.5/2.5 Mils
Seitenverhältnis 8:1 15:1
Vorlaufzeit 2 Wochen 5 Tage - 5 Wochen
Impedanztoleranz ±5% - ±10% ±5% - ±10%
Andere Techniken Goldene Finger, Blinde und vergrabene Löcher, Schälbare Lötmaske, Kantenbeschichtung, Kohlenstoffmaske, Countersink Loch,
Halb-/Castellated -Loch, Drücken Sie das Fit -Loch, Über verstopfte/gefüllt mit Harz, Via in pad (VIP, POFV), Multifinishes auf einer PCB

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PCBA -Fähigkeit


NEIN. Artikel Prozessfunktionsparameter
1 Bestellmenge Mehr als 1pcs
2 PCB -Typ Starre PCB, FPC, Starr-Flex-PCB
3 Assembly Tech SMT, Tht, Gemischte Technologie oder Pop
4 Komponentenbeschaffung Vollständiger schlüsselfertig, Teilweise schlüsselfertig, Vergeben
5 PCB -Größe 45*45mm -- 510*500mm
6 BGA -Paket BGA sie. 0.14mm, BGA 0,2 mm Tonhöhe
7 Teilepräsentation Band, Spule, Stock oder Tablett
8 Draht & Kabel Kabelbaum und Kabelbaugruppe
9 Qualitätsinspektion Visuell, Spi, Fai, Aoi; Röntgenprüfung
10 Montagegenauigkeit ±0.035mm (±0.025mm)
11 Min -Paket 01005 (0.4mm*0,2 mm)
12 Konforme Beschichtung Erhältlich von Maschine
13 IC -Inspektion Funktion, Elektrik- oder Dekap -Test
14 Vorlaufzeit 3 Tage - 5 Wochen
15 Andere Techniken Box -Build -Baugruppe, IC -Programmierung, Komponenten kosten dankbar, Funktion & Alterungstest als Brauch,
Drücken Sie die Anpassungsbaugruppe, SAC305 oder bessere Lötpaste verwendet, BGA -Neuballer oder Nacharbeit,
Schildabdeckungsbaugruppe für die EMI -Emissionskontrolle

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FPC -Fähigkeit


NEIN. Artikel Prozessfunktionsparameter
1 Schichtzahl 1-8 Schichten
2 FPC -Material PI, HAUSTIER, STIFT, FR-4
3 Enddicke 0.06-4.0mm
4 Brettgröße 250.00X1200 mm
5 Kupferfolie 12eins,18eins,35eins,70eins
6 Min Breite/Raum 3Tausend/3mil
7 Lochwall Kupferdicke 8-20μm
8 Oberflächenbehandlung Hall Leaddree, Zustimmen, Eintauchen Silber/Zinn, OSP
9 Umrissen Dimension ± 2mil
10 Lötwärmewiderstand 280℃ / 10Secs
11 Versteifungstyp PI, FR4, Edelstahl, Aluminium
12 Min. Lochtag (PTH) 0.1mm ± 3mil
13 Min. Lochtag (Npth) 0.25± 2mil
14 Max/min Soldatendicke 2Mil/0,5 Mio. (50eins/12.7um)
15 Min Slot 0.8mm × 1mm

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